The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 03, 2002
Filed:
Jul. 31, 2000
Applicant:
Inventors:
Jiangtao Wang, Cleveland Heights, OH (US);
John Callahan, Mentor, OH (US);
Dan Lillie, Bedford, OH (US);
Assignee:
Gould Electronics Inc., Eastlake, OH (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 1/504 ; C23C 1/600 ; C25D 1/100 ;
U.S. Cl.
CPC ...
B32B 1/504 ; C23C 1/600 ; C25D 1/100 ;
Abstract
A sheet material, comprised of a copper foil treated to have a stabilization layer thereon. The stabilization layer is comprised of zinc oxide, chromium oxide or a combination thereof having a thickness between about 5 Å and about 70 Å. A vapor deposited resistive material is provided on the stabilization layer.
Wang, Jiangtao. (2002). Applying resistive layer onto copper (U.S. Patent No. 6489035). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6489035
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile