The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 23, 2003

Filed:

Sep. 22, 2000
Applicant:
Inventors:

Jiangtao Wang, Cleveland Heights, OH (US);

Michael A. Centanni, Parma, OH (US);

Sidney J. Clouser, Chardon, OH (US);

Assignee:

Gould Electronics Inc., Eastlake, OH (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 1/7075 ; H01F 1/706 ;
U.S. Cl.
CPC ...
H01F 1/7075 ; H01F 1/706 ;
Abstract

A method of manufacturing a resistor foil, comprised of a copper layer having a first side and a second side. A tiecoat metal layer having a thickness of between 5 Å and 70 Å is disposed on the first side of the copper layer. A first layer of a first resistor metal having a thickness of between 100 Å and 500 Å is disposed on the tiecoat metal layer, and a second layer of a second resistor metal having a thickness of between 100 Å and 500 Å is disposed on the first layer of the first resistor metal. The first resistor metal has a resistance different from the second resistor metal.


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