For the Inventor, By the Inventor

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Santa Clara, CA, United States of America

Gem Services, Inc.

USPTO Granted Patents = 48

Forward Citations = 371

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20 inventors (with patents filed for the assignee):

Anthony Chia (45 out of 46 patents)

James Harnden (40 out of 41 patents)

Chu Weibing (35 out of 35 patents)

4. Richard Kent Williams (35 out of 319 patents)

5. Allen K Lam (9 out of 13 patents)

6. Hongbo Yang (7 out of 8 patents)

7. Anthony C Tsui (6 out of 10 patents)

8. Mohammad Eslamy (4 out of 4 patents)

9. Ming Zhou (3 out of 113 patents)

10. Hamza Yilmaz (3 out of 259 patents)

11. Xiaoguang Zeng (3 out of 8 patents)

12. Liming Wong (3 out of 4 patents)

13. Seishi Fujimaki (2 out of 2 patents)

14. Teng Hui (2 out of 2 patents)

15. Jian Xu (1 out of 104 patents)

Core Competencies:

Battery Switch

Semiconductor Package

Flip-Chip Process

Lead Frame Interconnection

Space-Efficient Package

Electroplating Features

Surface Mount Package

Matrix Leadframe

48 patents: Sort by Forward Citations

1. 8558368 - Bi-directional, reverse blocking battery switch (2013-10-15),

2. 8358017 - Semiconductor package featuring flip-chip die sandwiched between metal layers (2013-01-22),

3. 8120154 - Interconnection of lead frame to die utilizing flip chip process (2012-02-21),

4. 8106493 - Semiconductor device package having features formed by stamping (2012-01-31),

5. 7838339 - Semiconductor device package having features formed by stamping (2010-11-23),

6. 7691670 - Interconnection of lead frame to die utilizing flip chip process (2010-04-06),

7. 7667309 - Space-efficient package for laterally conducting device (2010-02-23),

8. 7553700 - Chemical-enhanced package singulation process (2009-06-30),

9. D588557 - 4040-28J matrix leadframe (2009-03-17),

10. D588080 - 2021-8J matrix leadframe (2009-03-10),

11. 7485498 - Space-efficient package for laterally conducting device (2009-02-03),

12. 7382044 - Semiconductor device package diepad having features formed by electroplating (2008-06-03),

13. D560623 - Quad-24JW surface mount package (2008-01-29),

14. D558694 - Quad-28JW surface mount package (2008-01-01),

15. 7215012 - Space-efficient package for laterally conducting device (2007-05-08),

GEM Services, Inc. is a leading provider of integrated facility maintenance solutions. With a strong commitment to customer satisfaction, GEM Services offers a wide range of services including janitorial, landscaping, security, and HVAC maintenance. Our experienced team of professionals ensures reliable and efficient service delivery to meet the diverse needs of our clients. Visit our website to learn more about our comprehensive facility maintenance solutions.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 16 2025

48 Patents

#95 in Santa Clara, CA

#1,666 in California

#7,026 in US

#14,113 in the World

Santa Clara, CA, United States of America

Gem Services, Inc.

Forward Citations = 371

20 inventors:

Anthony Chia (45 out of 46 patents)

James Harnden (40 out of 41 patents)

Chu Weibing (35 out of 35 patents)

4. Richard Kent Williams (35 out of 319 patents)

5. Allen K Lam (9 out of 13 patents)

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