For the Inventor, By the Inventor

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Santa Clara, CA, United States of America

Gem Services, Inc.

USPTO Granted Patents = 48

Forward Citations = 385

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20 inventors (with patents filed for the assignee):

Anthony Chia (45 out of 46 patents)

James Harnden (40 out of 41 patents)

Chu Weibing (35 out of 35 patents)

4. Richard Kent Williams (35 out of 319 patents)

5. Allen K Lam (9 out of 13 patents)

6. Hongbo Yang (7 out of 8 patents)

7. Anthony C Tsui (6 out of 10 patents)

8. Mohammad Eslamy (4 out of 4 patents)

9. Ming Zhou (3 out of 113 patents)

10. Hamza Yilmaz (3 out of 259 patents)

11. Xiaoguang Zeng (3 out of 9 patents)

12. Liming Wong (3 out of 4 patents)

13. Seishi Fujimaki (2 out of 2 patents)

14. Teng Hui (2 out of 2 patents)

15. Jian Xu (1 out of 110 patents)

Core Competencies:

Battery Switch

Flip-Chip Die

Lead Frame

Semiconductor Device

Surface Mount Package

Matrix Leadframe

Electroplating

Chemical Singulation

Space-Efficient Package

Diepad Features

Thermal Management

48 patents: Sort by Forward Citations

1. 8558368 - Bi-directional, reverse blocking battery switch (2013-10-15),

2. 8358017 - Semiconductor package featuring flip-chip die sandwiched between metal layers (2013-01-22),

3. 8120154 - Interconnection of lead frame to die utilizing flip chip process (2012-02-21),

4. 8106493 - Semiconductor device package having features formed by stamping (2012-01-31),

5. 7838339 - Semiconductor device package having features formed by stamping (2010-11-23),

6. 7691670 - Interconnection of lead frame to die utilizing flip chip process (2010-04-06),

7. 7667309 - Space-efficient package for laterally conducting device (2010-02-23),

8. 7553700 - Chemical-enhanced package singulation process (2009-06-30),

9. D588557 - 4040-28J matrix leadframe (2009-03-17),

10. D588080 - 2021-8J matrix leadframe (2009-03-10),

11. 7485498 - Space-efficient package for laterally conducting device (2009-02-03),

12. 7382044 - Semiconductor device package diepad having features formed by electroplating (2008-06-03),

13. D560623 - Quad-24JW surface mount package (2008-01-29),

14. D558694 - Quad-28JW surface mount package (2008-01-01),

15. 7215012 - Space-efficient package for laterally conducting device (2007-05-08),

Company Overview

Gem Services, Inc., based in Santa Clara, CA, specializes in advanced semiconductor packaging technologies. The company focuses on innovative solutions such as battery switch systems, flip-chip processes, and space-efficient packaging. Their expertise extends to lead frame interconnection and electroplating features, catering to the evolving demands of the semiconductor industry. By leveraging cutting-edge techniques in surface mount packaging and matrix leadframes, Gem Services aims to enhance performance and reliability in electronic applications.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 20 2026

48 Patents

#75 in Santa Clara, CA

#1,715 in California

#7,288 in US

#14,561 in the World

Santa Clara, CA, United States of America

Gem Services, Inc.

Forward Citations = 385

20 inventors:

Anthony Chia (45 out of 46 patents)

James Harnden (40 out of 41 patents)

Chu Weibing (35 out of 35 patents)

4. Richard Kent Williams (35 out of 319 patents)

5. Allen K Lam (9 out of 13 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Gem Services, Inc.. Retrieved from https://idiyas.com/company/gem-services

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

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