Shanghai, China

Teng Hui

This inventor holds 2 USPTO granted patents and 1 published patent application. Top assignee: Gem Services, Inc.. Active years: 2009.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Teng Hui. Retrieved from https://idiyas.com/inventor/teng-hui

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 2 

% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 2

Forward Citations = 22(Granted Patents)


Company Filing History:


Years Active: 2009

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2 patents (USPTO):Explore Patents

Title: The Innovations of Teng Hui

Introduction

Teng Hui is a notable inventor based in Shanghai, China. He has made significant contributions to the field of technology, particularly in the development of leadframes. With a total of 2 patents to his name, Teng has established himself as a key figure in his industry.

Latest Patents

Teng Hui's latest patents include the 4040-28J matrix leadframe and the 2021-8J matrix leadframe. These innovations reflect his commitment to advancing technology and improving product designs.

Career Highlights

Teng currently works at Gem Services, Inc., where he applies his expertise in leadframe technology. His work has been instrumental in enhancing the efficiency and performance of various electronic components.

Collaborations

Teng has collaborated with talented individuals such as James Harnden and Anthony Chia. These partnerships have fostered a creative environment that encourages innovation and the sharing of ideas.

Conclusion

Teng Hui's contributions to the field of technology through his patents and collaborations highlight his role as an influential inventor. His work continues to impact the industry positively.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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