The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 22, 2013
Filed:
Aug. 05, 2008
Anthony C. Tsui, Saratoga, CA (US);
Anthony C. Tsui, Saratoga, CA (US);
GEM Services, Inc., Santa Clara, CA (US);
Abstract
Embodiments in accordance with the present invention relate to flip-chip packages for semiconductor devices, which feature a die sandwiched between metal layers. One metal layer comprises portions of the lead frame configured to be in electrical and thermal communication with various pads on a first surface of the die (e.g. IC pads or MOSFET gate or source pads) through a solder ball contact. The other metal layer is configured to be in at least thermal communication with the opposite side of the die. Embodiments of packages in accordance with the present invention exhibit superior heat dissipation qualities, while avoiding the expense of wire bonding. Embodiments of the present invention are particularly suited for packaging of power devices.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile