Hongbo Yang

Title: Innovations of Hongbo Yang

Introduction

Hongbo Yang is a notable inventor based in Jiading, China. He has made significant contributions to the field of semiconductor technology, holding a total of 8 patents. His work focuses on improving the efficiency and functionality of electronic components.

Latest Patents

One of his latest patents is the bi-directional, reverse blocking battery switch. This invention relates to an improved package for a bi-directional and reverse blocking battery switch. According to one embodiment, two switches are oriented side-by-side, rather than end-to-end, in a die package. This configuration reduces the total switch resistance for a given die area, often reducing the resistance enough to avoid the use of backmetal in order to meet resistance specifications. The elimination of backmetal reduces the overall cost of the die package and removes the potential failure modes associated with the manufacture of backmetal. Additionally, this invention may allow for more pin connections and an increased pin pitch, resulting in redundant connections for higher current connections, thereby reducing electrical and thermal resistance and minimizing the costs of manufacture or implementation of the die package.

Another significant patent is related to a semiconductor device package having features formed by stamping. This invention involves the use of stamping to form features on a lead frame of a semiconductor device package. In one embodiment, portions of the lead frame, such as pins, are moved out of the horizontal plane of a diepad by stamping. Indentations or a complex cross-sectional profile, such as chamfered, may be imparted to portions of the pins and/or diepad by stamping. The complexity offered by such a stamped cross-sectional profile serves to enhance mechanical interlocking of the lead frame within the plastic molding of the package body. Other techniques such as selective electroplating and/or formation of a brown oxide guard band to limit spreading of adhesive material during die attach may be employed alone or in combination to facilitate fabrication of a package having such stamped features.

Career Highlights

Throughout his career, Hongbo Yang has worked with various companies, including Gem Services, Inc. His experience in the semiconductor industry has allowed him to develop innovative solutions that address common challenges in electronic component design and manufacturing.

Collaborations

Hongbo has collaborated with notable professionals in his field, including Anthony Chia and James Harnden. These collaborations have contributed to the advancement of technology in semiconductor devices.

Conclusion