The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 15, 2013

Filed:

Oct. 31, 2011
Applicants:

Anthony Chia, Singapore, SG;

Liming Wong, JiaDing, CN;

Hongbo Yang, JiaDing, CN;

Anthony C. Tsui, Saratoga, CA (US);

Hui Teng, JiaDing, CN;

Ming Zhou, Shanghai, CN;

Inventors:

James Harnden, Hollister, CA (US);

Anthony Chia, Singapore, SG;

Liming Wong, JiaDing, CN;

Hongbo Yang, JiaDing, CN;

Anthony C. Tsui, Saratoga, CA (US);

Hui Teng, JiaDing, CN;

Ming Zhou, Shanghai, CN;

Assignee:

GEM Services, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 29/66 (2006.01); H01L 23/62 (2006.01); H01L 23/34 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01); H01L 29/00 (2006.01); H01L 21/336 (2006.01);
U.S. Cl.
CPC ...
Abstract

Embodiments of the present invention relate to an improved package for a bi-directional and reverse blocking battery switch. According to one embodiment, two switches are oriented side-by-side, rather than end-to-end, in a die package. This configuration reduces the total switch resistance for a given die area, often reducing the resistance enough to avoid the use of backmetal in order to meet resistance specifications. Elimination of backmetal reduces the overall cost of the die package and removes the potential failure modes associated with the manufacture of backmetal. Embodiments of the present invention may also allow for more pin connections and an increased pin pitch. This results in redundant connections for higher current connections, thereby reducing electrical and thermal resistance and minimizing the costs of manufacture or implementation of the die package.


Find Patent Forward Citations

Loading…