The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 23, 2010
Filed:
Aug. 14, 2008
Anthony C. Tsui, Saratoga, CA (US);
Mohammad Eslamy, Palo Alto, CA (US);
Anthony Chia, Singapore, SG;
Hongbo Yang, Shanghai, CN;
Ming Zhou, Shanghai, CN;
Jian Xu, Shanghai, CN;
Anthony C. Tsui, Saratoga, CA (US);
Mohammad Eslamy, Palo Alto, CA (US);
Anthony Chia, Singapore, SG;
Hongbo Yang, Shanghai, CN;
Ming Zhou, Shanghai, CN;
Jian Xu, Shanghai, CN;
GEM Services, Inc., Santa Clara, CA (US);
Abstract
Embodiments of the present invention relate to the use of stamping to form features on a lead frame of a semiconductor device package. In one embodiment, portions of the lead frame such as pins are moved out of the horizontal plane of a diepad by stamping. In certain embodiments, indentations or a complex cross-sectional profile, such as chamfered, may be imparted to portions of the pins and/or diepad by stamping. The complexity offered by such a stamped cross-sectional profile serves to enhance mechanical interlocking of the lead frame within the plastic molding of the package body. Other techniques such as selective electroplating and/or formation of a brown oxide guard band to limit spreading of adhesive material during die attach, may be employed alone or in combination to facilitate fabrication of a package having such stamped features.