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Santa Clara, CA, United States of America

Component Re-Engineering Company, Inc.

USPTO Granted Patents = 15

EPO Patents = 1

Forward Citations = 23

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13 inventors (with patents filed for the assignee):

Frank R Balma (13 out of 22 patents)

Brent Donald Alfred Elliot (12 out of 18 patents)

Alfred Grant Elliot (11 out of 22 patents)

4. Richard Erich Schuster (11 out of 22 patents)

5. Dennis George Rex (11 out of 23 patents)

6. Alexander M Veytser (11 out of 33 patents)

7. Brent D Elliot (3 out of 15 patents)

8. Michael Parker (2 out of 12 patents)

9. Alfred Grant Elliott (2 out of 2 patents)

10. Jason Stephens (1 out of 9 patents)

11. Guleid Hussen (1 out of 8 patents)

12. Jeff Cunha (1 out of 1 patent)

13. Alexander Veyster (1 out of 2 patents)

14. Brent DA Elliot (0 patent)

15 patents: Sort by Forward Citations

1. 10646941 - Method for manufacture of a multi-layer plate device (2020-05-12),

2. 10593584 - Electrostatic chuck for clamping in high temperature semiconductor processing and method of making same (2020-03-17),

3. 10471531 - High temperature resistant silicon joint for the joining of ceramics (2019-11-12),

4. 10384283 - Method for making a high temperature resistant silicon alloy joint for the joining of ceramics and devices using same (2019-08-20),

5. 10287215 - Low temperature method for hermetically joining non-diffusing ceramic materials in multi-layer plate devices (2019-05-14),

6. 10213858 - Multi-layer plate device (2019-02-26),

7. 10153183 - High speed low temperature method for manufacturing and repairing semiconductor processing equipment and equipment produced using same (2018-12-11),

8. 9999947 - Method for repairing heaters and chucks used in semiconductor processing (2018-06-19),

9. 9984866 - Multiple zone heater (2018-05-29),

10. 9624137 - Low temperature method for hermetically joining non-diffusing ceramic materials (2017-04-18),

11. 9556074 - Method for manufacture of a multi-layer plate device (2017-01-31),

12. 9315424 - Multi-layer plate device (2016-04-19),

13. 8932690 - Plate and shaft device (2015-01-13),

14. 8789743 - Hermetically joined ceramic assemblies and low temperature method for hermetically joining ceramic materials (2014-07-29),

15. 8684256 - Method for hermetically joining plate and shaft devices including ceramic materials used in semiconductor processing (2014-04-01),

Company Overview

Component Re-Engineering Company, Inc., based in Santa Clara, CA, specializes in advanced engineering solutions focused on the re-engineering of electronic components. The company is dedicated to enhancing the lifecycle and performance of existing technologies through innovative design and manufacturing processes. With expertise in various sectors, including telecommunications and consumer electronics, it aims to provide sustainable alternatives that meet the evolving demands of the technology landscape.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 20 2026

15 Patents

#211 in Santa Clara, CA

#5,031 in California

#21,068 in US

#39,959 in the World

Santa Clara, CA, United States of America

Component Re-Engineering Company, Inc.

Forward Citations = 23

13 inventors:

Frank R Balma (13 out of 22 patents)

Brent Donald Alfred Elliot (12 out of 18 patents)

Alfred Grant Elliot (11 out of 22 patents)

4. Richard Erich Schuster (11 out of 22 patents)

5. Dennis George Rex (11 out of 23 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Component Re-Engineering Company, Inc.. Retrieved from https://idiyas.com/company/component-re-engineering-company

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

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