logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10593584 B1

PDFFull Text
Date of Patent:
Mar. 17, 2020

Filed:

Nov. 02, 2016

Electrostatic chuck for clamping in high temperature semiconductor processing and method of making same

Applicant:

Component Re-engineering Company, Inc., Santa Clara, CA (US);

Inventors:

Brent Donald Alfred Elliot, Cupertino, CA (US);

Frank Balma, Los Gatos, CA (US);

Michael Parker, Brentwood, CA (US);

Jason Stephens, San Francisco, CA (US);

Guleid Hussen, San Francisco, CA (US);

Assignee:

Component Re-Engineering Company, Inc., Santa Clara, CA (US);

Attorney:

Michael A. Guth

Primary Examiner:

Stephen W Jackson

Int. Cl.
CPC ...
H01T 23/00 (2006.01); H01L 21/683 (2006.01); B23Q 3/15 (2006.01); B23K 1/00 (2006.01); C04B 37/00 (2006.01); H01L 21/687 (2006.01); B23K 1/19 (2006.01); B23K 1/20 (2006.01); B23K 1/008 (2006.01); B23K 103/18 (2006.01); B23K 103/00 (2006.01); B23K 101/42 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6833 (2013.01); B23K 1/00 (2013.01); B23K 1/008 (2013.01); B23K 1/0016 (2013.01); B23K 1/19 (2013.01); B23K 1/206 (2013.01); B23Q 3/15 (2013.01); C04B 37/00 (2013.01); C04B 37/003 (2013.01); H01L 21/6831 (2013.01); H01L 21/68757 (2013.01); B23K 2101/42 (2018.08); B23K 2103/18 (2018.08); B23K 2103/52 (2018.08); B23K 2103/54 (2018.08); C04B 2237/121 (2013.01); C04B 2237/343 (2013.01); C04B 2237/366 (2013.01); C04B 2237/50 (2013.01); C04B 2237/68 (2013.01);
Abstract

An electrostatic chuck with a top surface adapted for Johnsen-Rahbek clamping in the temperature range of 500 C. to 750 C. The top surface may be sapphire. The top surface is attached to the lower portion of the electrostatic chuck using a braze layer able to withstand corrosive processing chemistries. A method of manufacturing an electrostatic chuck with a top surface adapted for Johnsen-Rahbek clamping in the temperature range of 500 C. to 750 C.

Find Patent Forward Citations

Loading…