For the Inventor, By the Inventor

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Hsinchu, Taiwan

Ap Memory Technology Corporation

USPTO Granted Patents = 26

Trademarks = 2

Forward Citations = 40

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23 inventors (with patents filed for the assignee):

Wenliang Chen (18 out of 18 patents)

Lin Ma (10 out of 10 patents)

Chun Yi Lin (8 out of 8 patents)

4. Masaru Haraguchi (6 out of 29 patents)

5. Chien-An Yu (4 out of 4 patents)

6. Jun Gu (3 out of 3 patents)

7. Alessandro Minzoni (3 out of 3 patents)

8. Takashi Kubo (3 out of 140 patents)

9. Wen Liang Chen (3 out of 3 patents)

10. Yoshitaka Fujiishi (3 out of 10 patents)

11. Hung-Piao Ma (3 out of 3 patents)

12. Girish Nanjappa (3 out of 3 patents)

13. Keng Lone Wong (3 out of 3 patents)

14. Chien An Yu (2 out of 2 patents)

15. Owen Yuwen Li (2 out of 2 patents)

Core Competencies:

Semiconductor Structure

Memory Device

Capacitor Device

Data Line Structure

Identification Structure

Microelectronic Package

DRAM Chiplet

Surge Protection Unit

Circuit Assembly

System in Package

Bonding Tested Wafers

Decoupling Structure

26 patents: Sort by Forward Citations

1. 12727521 - Semiconductor structure and manufacturing method thereof (2026-09-01),

2. 12609246 - Capacitor device and method for manufacturing the same (2026-04-21),

3. 12499931 - Memory device having segmented data line structure (2025-12-16),

4. 12394473 - Interface of a memory circuit (2025-08-19),

5. 12334139 - Memory device having merged banks on substrate, and method for operating memory device (2025-06-17),

6. 12317521 - Capacitor device and manufacturing method therefor (2025-05-27),

7. 12272643 - Semiconductor device with identification structure, method for manufacturing and tracing production information thereof (2025-04-08),

8. 12243606 - Semiconductor device, memory system and method of controlling semiconductor device thereof (2025-03-04),

9. 12176320 - Semiconductor structure and methods for bonding tested wafers and testing pre-bonded wafers (2024-12-24),

10. 12074103 - Circuit assembly (2024-08-27),

11. 12048142 - Methods for manufacturing a plurality of semiconductor structures and system in package (2024-07-23),

12. 11967363 - Display controller having a surge protection unit and display system thereof (2024-04-23),

13. 11887974 - Method of operating microelectronic package (2024-01-30),

14. 11842763 - Interface of a memory circuit and memory system thereof (2023-12-12),

15. 11688681 - DRAM chiplet structure and method for manufacturing the same (2023-06-27),

Company Overview

Ap Memory Technology Corporation, headquartered in Hsinchu, Taiwan, specializes in the design and manufacturing of advanced memory solutions. The company focuses on developing innovative memory products that cater to a variety of applications, including consumer electronics, computing, and automotive sectors. With a commitment to research and development, Ap Memory aims to enhance performance and efficiency in memory technology, positioning itself as a key player in the global semiconductor industry.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 13 2026

26 Patents

#144 in Hsinchu

#665 in Taiwan

#24,806 in the World

Hsinchu, Taiwan

Ap Memory Technology Corporation

Forward Citations = 40

23 inventors:

Wenliang Chen (18 out of 18 patents)

Lin Ma (10 out of 10 patents)

Chun Yi Lin (8 out of 8 patents)

4. Masaru Haraguchi (6 out of 29 patents)

5. Chien-An Yu (4 out of 4 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Ap Memory Technology Corporation. Retrieved from https://idiyas.com/company/ap-memory-technology

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

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