The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 08, 2025

Filed:

May. 19, 2022
Applicant:

Ap Memory Technology Corporation, Hsinchu County, TW;

Inventor:

Wenliang Chen, Hsinchu County, TW;

Assignee:

AP MEMORY TECHNOLOGY CORPORATION, Hsinchu County, TW;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/525 (2006.01); H01L 21/768 (2006.01); H01L 23/528 (2006.01); H01L 23/532 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5258 (2013.01); H01L 21/76802 (2013.01); H01L 21/76877 (2013.01); H01L 23/528 (2013.01); H01L 23/53209 (2013.01);
Abstract

A semiconductor device with an identification structure is provided. The semiconductor device includes a substrate and a metallization structure over the substrate. The metallization structure includes an interconnection region having a plurality of metal layers and an identification region isolated from the interconnection region. The identification region has an identification structure leveled with one of the metal layer. The identification structure includes at least one exposing recess and at least one exposing fuse. A method for manufacturing a semiconductor device with an identification structure and a method for tracing a production information of a semiconductor device are also provided.


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