The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 27, 2024
Filed:
Jun. 01, 2022
Applicant:
Ap Memory Technology Corp., Zhubei, TW;
Inventors:
Wenliang Chen, Zhubei, TW;
Jun Gu, Zhubei, TW;
Masaru Haraguchi, Tokyo, JP;
Takashi Kubo, Tokyo, JP;
Chien-An Yu, Zhubei, TW;
Chun Yi Lin, Zhubei, TW;
Assignee:
AP Memory Technology Corp., Zhubei, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/522 (2006.01); H01L 23/48 (2006.01); H01L 23/532 (2006.01); H10B 12/00 (2023.01); H01L 23/40 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5223 (2013.01); H01L 23/481 (2013.01); H01L 23/5329 (2013.01); H10B 12/30 (2023.02); H01L 23/40 (2013.01);
Abstract
A circuit assembly includes an integrated circuit (IC) die and a capacitor die. The IC die has a first hybrid bonding layer. The capacitor die is stacked with the IC die, and is configured to include a capacitor coupled to the IC die, and has a second hybrid bonding layer in contact with the first hybrid bonding layer; wherein the IC die is electrically coupled to the capacitor die through the first hybrid bonding layer and the second hybrid bonding layer.