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Takamatsu, Japan

Aoi Electronics Co., Ltd.

USPTO Granted Patents = 32

% Expired Patents = 34.4

EPO Patents = 1

Trademarks = 1

Forward Citations = 117

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45 inventors (with patents filed for the assignee):

Hiroki Hayashi (8 out of 9 patents)

Takashi Konno (7 out of 7 patents)

Katsuhiro Takao (5 out of 5 patents)

4. Masato Suzuki (5 out of 11 patents)

5. Gen Hashiguchi (3 out of 15 patents)

6. Norio Yamaji (3 out of 3 patents)

7. Masatoshi Yasutake (3 out of 50 patents)

8. Masanao Munekane (3 out of 9 patents)

9. Akihito Hirai (2 out of 19 patents)

10. Shinji Wakisaka (2 out of 20 patents)

11. Shuichi Sawamoto (2 out of 2 patents)

12. Koji Iwabu (2 out of 2 patents)

13. Joichi Saito (2 out of 2 patents)

14. Takeshi Wakabayashi (2 out of 41 patents)

15. Ichiro Kono (2 out of 2 patents)

Core Competencies:

Semiconductor Device

Manufacturing Method

Stacked Devices

Packaging

Thermal Head

Photoreception Device

Electrostatic Induction

Nanogripper

Atomic Force Microscope

Scanning Probe Microscope

Particle Removal

32 patents: Sort by Forward Citations

1. 12394744 - Semiconductor device (2025-08-19),

2. 12237248 - Semiconductor device and method for manufacture of semiconductor device (2025-02-25),

3. 12191362 - Stacked semiconductor devices in sealants and interconnected with pillar electrodes (2025-01-07),

4. 11521948 - Method of manufacturing semiconductor device (2022-12-06),

5. 11328998 - Semiconductor device and manufacturing method of semiconductor device (2022-05-10),

6. 11075180 - Semiconductor device and method of manufacturing the semiconductor device (2021-07-27),

7. 10953663 - Thermal head (2021-03-23),

8. 10854560 - Semiconductor device and semiconductor device manufacturing method (2020-12-01),

9. 10854557 - Semiconductor device packaging with metallic shielding layer (2020-12-01),

10. 9812423 - Semiconductor device having wire formed with loop portion and method for producing the semiconductor device (2017-11-07),

11. 9640478 - Semiconductor device having low dielectric insulating film and manufacturing method of the same (2017-05-02),

12. 9607861 - Semiconductor device and method of manufacturing the same (2017-03-28),

13. 9570407 - Method for manufacturing semiconductor device and semiconductor device (2017-02-14),

14. 9448102 - Photoreception device with an insulating resin mass, and method for producing photoreception device (2016-09-20),

15. 9425710 - Electrostatic induction conversion device and DC-DC converter (2016-08-23),

Company Overview

Aoi Electronics Co., Ltd. is a prominent player in the electronics sector, specializing in the development and manufacturing of advanced electronic components and systems. The company focuses on innovative solutions for various applications, including telecommunications, automotive, and industrial automation. With a strong emphasis on research and development, Aoi Electronics aims to enhance product performance and reliability, catering to a diverse clientele both domestically in Japan and internationally.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 13 2026

32 Patents

#1 in Takamatsu

#2,237 in Japan

#20,671 in the World

Takamatsu, Japan

Aoi Electronics Co., Ltd.

Forward Citations = 117

45 inventors:

Hiroki Hayashi (8 out of 9 patents)

Takashi Konno (7 out of 7 patents)

Katsuhiro Takao (5 out of 5 patents)

4. Masato Suzuki (5 out of 11 patents)

5. Gen Hashiguchi (3 out of 15 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Aoi Electronics Co., Ltd.. Retrieved from https://idiyas.com/company/aoi-electronics-company

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

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