The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 19, 2025

Filed:

Jul. 13, 2020
Applicant:

Aoi Electronics Co., Ltd., Kagawa, JP;

Inventors:

Katsuhiro Takao, Kagawa, JP;

Atsushi Kuroha, Kagawa, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
H01L 24/40 (2013.01); H01L 23/3107 (2013.01); H01L 23/49562 (2013.01); H01L 24/16 (2013.01); H01L 24/73 (2013.01); H01L 2224/1601 (2013.01); H01L 2224/16245 (2013.01); H01L 2224/40245 (2013.01); H01L 2224/73255 (2013.01); H01L 2924/13091 (2013.01);
Abstract

A semiconductor device includes: a semiconductor element having a first electrode and a second electrode on a first surface, and a third electrode on a second surface, wherein continuity between the second electrode and the third electrode is controlled by a voltage applied to the first electrode; a conductive first lead that is electrically connected to the first electrode and extends beyond a periphery of the first surface; and a conductive second lead that is electrically connected to the second electrode and extends beyond the periphery of the first surface. At least one edge of the periphery of the first surface faces neither the first lead nor the second lead, and portions of the first lead and the second lead that face the periphery of the first surface are provided with respective grooves.


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