The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 10, 2022
Filed:
Sep. 16, 2020
Applicant:
Aoi Electronics Co., Ltd., Takamatsu, JP;
Inventor:
Shinji Wakisaka, Hanno, JP;
Assignee:
AOI Electronics Co., Ltd., Takamatsu, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/538 (2006.01); H01L 21/56 (2006.01); H01L 29/40 (2006.01); H01L 29/06 (2006.01); H01L 25/00 (2006.01); H01L 23/00 (2006.01); H01L 21/768 (2006.01); H01L 25/16 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5384 (2013.01); H01L 21/56 (2013.01); H01L 21/76802 (2013.01); H01L 21/76877 (2013.01); H01L 24/13 (2013.01); H01L 24/81 (2013.01); H01L 25/16 (2013.01); H01L 25/50 (2013.01); H01L 29/06 (2013.01); H01L 29/401 (2013.01);
Abstract
A semiconductor device includes: a first semiconductor element having a first electrode on a main surface side thereof and a second electrode on a back surface side thereof; a base material provided with a connection conductor connected to the first electrode; a sealing resin provided on the base material to seal the first semiconductor element; and a first via provided in the sealing resin and electrically connected to the second electrode of the first semiconductor element.