The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 25, 2025
Filed:
Sep. 25, 2019
Applicant:
Aoi Electronics Co., Ltd., Takamatsu, JP;
Inventors:
Katsuhiro Takao, Takamatsu, JP;
Takashi Suzuki, Takamatsu, JP;
Assignee:
AOI Electronics Co., Ltd., Takamatsu-Kagawa, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 25/00 (2006.01); H01L 25/16 (2023.01); H02M 7/5387 (2007.01);
U.S. Cl.
CPC ...
H01L 23/49575 (2013.01); H01L 21/4803 (2013.01); H01L 21/4828 (2013.01); H01L 23/3121 (2013.01); H01L 23/49558 (2013.01); H01L 23/49562 (2013.01); H01L 25/16 (2013.01); H01L 25/50 (2013.01); H02M 7/5387 (2013.01); H01L 24/32 (2013.01); H01L 24/40 (2013.01); H01L 24/92 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/40139 (2013.01); H01L 2224/40245 (2013.01); H01L 2224/92246 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/1426 (2013.01);
Abstract
A semiconductor device includes at least one first semiconductor element having a first electrode, a second semiconductor element having a second electrode, a first lead terminal connected to the first electrode of the at least one first semiconductor element, a second lead terminal connected to the second electrode of the second semiconductor element, a first resin with which the first lead terminal and the second lead terminal are sealed, and a second resin with which the at least one first semiconductor element and the second semiconductor element are sealed.