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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9607861 B1

PDFFull Text
Date of Patent:
Mar. 28, 2017

Filed:

Feb. 04, 2016

Semiconductor device and method of manufacturing the same

Applicant:

Tera Probe, Inc., Yokohama, Kanagawa, JP;

Inventors:

Junji Shiota, Hamura, JP;

Ichiro Kono, Higashiyamato, JP;

Assignee:

AOI ELECTRONICS CO., LTD., Kagawa, JP;

Attorney:

Holtz, Holtz & Volek PC

Primary Examiner:

(Vikki) Hoa B Trinh

Int. Cl.
CPC ...
H01L 21/44 (2006.01); H01L 21/56 (2006.01); H01L 21/683 (2006.01); H01L 21/304 (2006.01); H01L 21/306 (2006.01); H01L 21/78 (2006.01); H01L 21/308 (2006.01); H01L 21/768 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 29/06 (2006.01); H01L 23/525 (2006.01);
U.S. Cl.
CPC ...
H01L 21/56 (2013.01); H01L 21/304 (2013.01); H01L 21/3081 (2013.01); H01L 21/30625 (2013.01); H01L 21/6835 (2013.01); H01L 21/6836 (2013.01); H01L 21/768 (2013.01); H01L 21/78 (2013.01); H01L 23/3114 (2013.01); H01L 23/562 (2013.01); H01L 24/11 (2013.01); H01L 24/12 (2013.01); H01L 23/525 (2013.01); H01L 29/0657 (2013.01); H01L 2221/6834 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/68381 (2013.01); H01L 2224/94 (2013.01);
Abstract

A method of manufacturing a semiconductor device, including steps of: (a) bonding a support plate to a first main face of a wafer, the first main face having an integrated circuit disposed thereon; (b) thinning the wafer by polishing or grinding a second main face after step (a), the second main face being opposite to the first main face; (c) dividing the wafer into multiple chip bodies concurrently with or after step (b); (d) bonding multiple reinforcing layers to second main faces of the respective chip bodies after step (c); and (e) removing the support plate after step (d).

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Shiota, Junji. (2017). Semiconductor device and method of manufacturing the same (U.S. Patent No. 9607861). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9607861

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