The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 27, 2021
Filed:
Aug. 04, 2017
Applicant:
Aoi Electronics Co., Ltd., Takamatsu, JP;
Inventor:
Katsuhiro Takao, Marugame, JP;
Assignee:
AOI Electronics Co., Ltd., Takamatsu, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01); H01L 23/00 (2006.01); H01L 21/56 (2006.01); H01L 21/78 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 24/05 (2013.01); H01L 21/56 (2013.01); H01L 21/78 (2013.01); H01L 23/3185 (2013.01); H01L 24/03 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 2224/02206 (2013.01); H01L 2224/03019 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/13082 (2013.01); H01L 2224/13139 (2013.01); H01L 2224/13147 (2013.01);
Abstract
A semiconductor device includes a semiconductor element having a plated portion on a part of a main surface and a protective member that seals surfaces of the semiconductor element except for the main surface, wherein the plated portion is electrically connected to a circuit in the semiconductor element.
Takao, Katsuhiro. (2021). Semiconductor device and method of manufacturing the semiconductor device (U.S. Patent No. 11075180). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11075180
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile