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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9570407 B1

PDFFull Text
Date of Patent:
Feb. 14, 2017

Filed:

Mar. 28, 2014

Method for manufacturing semiconductor device and semiconductor device

Applicant:

Aoi Electronics Co., Ltd., Takamatsu-shi, Kagawa, JP;

Inventors:

Takahiro Ebisui, Takamatsu, JP;

Masako Furuichi, Takamatsu, JP;

Shuji Inoue, Ibaraki, JP;

Assignee:

AOI Electronics Co., Ltd., Takamatsu-shi, JP;

Attorney:

Crowell & Moring LLP

Primary Examiner:

Tram H Nguyen

Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 23/00 (2006.01); H01L 23/10 (2006.01); H01L 23/31 (2006.01); H01L 21/50 (2006.01); H01L 21/56 (2006.01); H01L 21/48 (2006.01); H01L 21/52 (2006.01); H01L 21/78 (2006.01); H01L 23/29 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/562 (2013.01); H01L 21/4875 (2013.01); H01L 21/50 (2013.01); H01L 21/52 (2013.01); H01L 21/56 (2013.01); H01L 21/561 (2013.01); H01L 21/78 (2013.01); H01L 23/10 (2013.01); H01L 23/29 (2013.01); H01L 23/3185 (2013.01); H01L 23/49811 (2013.01); H01L 24/97 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48465 (2013.01); H01L 2224/8592 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/16151 (2013.01); H01L 2924/16195 (2013.01);
Abstract

A method for manufacturing a semiconductor device includes: a fixing step in which semiconductor chips are mounted on and fixed to predetermined positions on an upper surface of a single starting substrate to form individual substrates; a connection step in which electrodes of the semiconductor chips and of the starting substrate are connected by wires; a sealing step in which on the upper surface of the starting substrate, the resin is potted among the semiconductor chips to seal an entire lateral circumference of each of the semiconductor chip; a bonding step in which a single starting protective cover to form individual protective covers is bonded to a surface of the resin so as to extend the semiconductor chips; and a cutting step in which an assembly of the semiconductor devices formed by bonding the starting protective cover to the starting substrate via the resin is cut to the semiconductor devices.

Find Patent Forward Citations

Ebisui, Takahiro. (2017). Method for manufacturing semiconductor device and semiconductor device (U.S. Patent No. 9570407). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9570407

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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