Forward Citations = 135

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9 inventors (with patents filed for the assignee):

Eva Igner (4 out of 8 patents)

Dror Hurwitz (4 out of 7 patents)

Boris Statnikov (2 out of 3 patents)

4. Benny Michaeli (2 out of 3 patents)

5. Dror Katz (2 out of 4 patents)

6. Boris Yofis (2 out of 4 patents)

7. Mordechay Farkash (1 out of 2 patents)

8. Mardechay Farkash (1 out of 1 patent)

9. Amit Zeidler (1 out of 1 patent)

4 patents: Sort by Forward Citations

1. 7669320 - Coreless cavity substrates for chip packaging and their fabrication (2010-03-02),

2. 7635641 - Integrated circuit support structures and their fabrication (2009-12-22),

3. 6280640 - Process for manufacturing a chip carrier substrate (2001-08-28),

4. 6262478 - Electronic interconnect structure and method for manufacturing it (2001-07-17),

Amitec-advanced Multilayer Interconnect Technologies Ltd. is a leading provider of advanced multilayer interconnect solutions for various industries. With a focus on innovation and quality, Amitec offers a wide range of products and services to meet the evolving needs of its customers. From design and development to manufacturing and testing, Amitec is committed to delivering high-performance solutions that exceed expectations.

This text is generated by artificial intelligence and may not be accurate.

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USPTO Data Jan 1 1976 - Dec 30 2025

4 Patents

#15 in Migdal Haemek

#1,353 in Israel

Migdal Haemek, Israel

Amitec-advanced Multilayer Interconnect Technologies Ltd.