Mordechay Farkash

Title: The Innovations of Mordechay Farkash

Introduction

Mordechay Farkash is a notable inventor based in Haifa, Israel. He has made significant contributions to the field of electronic support structures, holding a total of 2 patents. His work focuses on advanced multilayer coreless support structures, which are essential for modern electronic applications.

Latest Patents

Farkash's latest patents include "Advanced multilayer coreless support structures and method for their fabrication." This patent describes a method for fabricating a free-standing membrane that includes a via array in a dielectric. The process involves creating a membrane of conductive vias surrounded by a dielectric on a sacrificial carrier, followed by detaching the membrane to form a laminated array. Another significant patent is "Coreless cavity substrates for chip packaging and their fabrication." This invention outlines a method for creating an integrated circuit (IC) support that accommodates multiple IC dies, utilizing a stack of alternating layers of copper features and insulating materials.

Career Highlights

Throughout his career, Farkash has worked with companies such as Amitec - Advanced Multilayer Interconnect Technologies Ltd. His expertise in multilayer interconnect technologies has positioned him as a key player in the development of innovative electronic solutions.

Collaborations

Farkash has collaborated with notable professionals in his field, including Dror Hurwitz and Eva Igner. These collaborations have further enhanced his contributions to electronic support structures.

Conclusion

Mordechay Farkash's innovative work in the field of electronic support structures has led to significant advancements in technology. His patents reflect a deep understanding of the complexities involved in modern electronics, making him a valuable inventor in this domain.