The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 02, 2010

Filed:

Apr. 19, 2007
Applicants:

Dror Hurwitz, Gilboa, IL;

Mordechay Farkash, Haifa, IL;

Eva Igner, Haifa, IL;

Boris Statnikov, Nazareth Ilit, IL;

Benny Michaeli, Nazareth Ilit, IL;

Inventors:

Dror Hurwitz, Gilboa, IL;

Mordechay Farkash, Haifa, IL;

Eva Igner, Haifa, IL;

Boris Statnikov, Nazareth Ilit, IL;

Benny Michaeli, Nazareth Ilit, IL;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 3/10 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method for fabricating an IC support for supporting a first IC die connected in series with a second IC die; the IC support comprising a stack of alternating layers of copper features and vias in insulating surround, the first IC die being bondable onto the IC support, and the second IC die being bondable within a cavity inside the IC support, wherein the cavity is formed by etching away a copper base and selectively etching away built up copper.


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