Benny Michaeli is a notable inventor based in Nazerth Illit, Israel. He has made significant contributions to the field of electronic support structures, holding a total of 3 patents. His innovative work focuses on advanced multilayer coreless support structures and methods for their fabrication.

Latest Patents

Michaeli's latest patents include "Advanced multilayer coreless support structures and method for their fabrication." This patent describes a method for fabricating a free-standing membrane that includes a via array in a dielectric, which serves as a precursor for constructing superior electronic support structures. The process involves creating a membrane of conductive vias in a dielectric surround on a sacrificial carrier and then detaching the membrane to form a free-standing laminated array. Another significant patent is "Coreless cavity substrates for chip packaging and their fabrication." This invention outlines a method for fabricating an integrated circuit (IC) support that accommodates two IC dies, utilizing a stack of alternating layers of copper features and vias in an insulating surround.

Career Highlights

Throughout his career, Benny Michaeli has worked with companies such as Amitec - Advanced Multilayer Interconnect Technologies Ltd. His experience in the industry has allowed him to develop cutting-edge technologies that enhance electronic packaging solutions.

Collaborations

Michaeli has collaborated with notable professionals in his field, including Dror Hurwitz and Eva Igner. These partnerships have contributed to the advancement of his innovative projects and patents.

Conclusion

Benny Michaeli is a distinguished inventor whose work in electronic support structures has led to several important patents. His contributions continue to influence the field of electronic packaging and support technologies.

This text is generated by artificial intelligence and may not be accurate.

Please report any incorrect information to support@idiyas.com