Amitec-advanced Multilayer Interconnect Technologies Ltd.

Amitec-advanced Multilayer Interconnect Technoloiges Ltd.

Mordechay Farkash

Eva Igner

Dror Hurwitz

Benny Michaeli

Boris Statnikov

A method of fabricating a free standing membrane including via array in a dielectric for use as a precursor in the construction of superior electronic support structures, includes the steps of fabricating a membrane of conductive vias in a dielectric surround on a sacrificial carrier, and detaching the membrane from the sacrificial carrier to form a free standing laminated array. An electronic substrate based on such a free standing membrane may be formed by thinning and planarizing laminated array, followed by terminating.

Advanced multilayer coreless support structures and method for their fabrication

A method for fabricating an IC support for supporting a first IC die connected in series with a second IC die; the IC support comprising a stack of alternating layers of copper features and vias in insulating surround, the first IC die being bondable onto the IC support, and the second IC die being bondable within a cavity inside the IC support, wherein the cavity is formed by etching away a copper base and selectively etching away built up copper.

Growing community of inventors

Haifa, Israel

Mordechay Farkash