Boris Yofis

Title: The Innovative Contributions of Boris Yofis

Introduction

Boris Yofis is a notable inventor based in Haifa, Israel. He has made significant contributions to the field of chip carrier substrates, holding a total of four patents. His work has advanced the technology used in electronic components, showcasing his expertise and innovative spirit.

Latest Patents

Boris Yofis's latest patents include a process for manufacturing a chip carrier substrate. This process involves several intricate steps, such as providing a first layer of copper conductor on a substrate, forming a first layer of barrier metal, and creating a layer of aluminum. The process continues with the formation of a second barrier metal, patterning the top barrier metal, anodizing the aluminum, and polishing the polymeric dielectric to expose the studs. The resulting chip carrier substrate features a lower layer and at least one upper layer of copper conductors, interconnected by aluminum studs and surrounded by a polymeric dielectric material.

Career Highlights

Throughout his career, Boris Yofis has worked with Amitec-Advanced Multilayer Interconnect Technologies Ltd. His experience in this company has allowed him to apply his innovative ideas in practical settings, contributing to the development of advanced technologies in the field.

Collaborations

Boris has collaborated with notable individuals such as Dror Hurwitz and Dror Katz. These collaborations have likely enriched his work and led to further advancements in his projects.

Conclusion

Boris Yofis is a distinguished inventor whose work in chip carrier substrates has made a lasting impact on the technology industry. His patents and collaborations reflect his commitment to innovation and excellence in his field.