Dror Katz

Title: Dror Katz: Innovator in Chip Carrier Substrate Technology

Introduction

Dror Katz is a notable inventor based in Haifa, Israel, recognized for his contributions to the field of chip carrier substrate technology. With a total of four patents to his name, Katz has made significant advancements in manufacturing processes that enhance the performance and reliability of electronic components.

Latest Patents

Dror Katz's latest patents include a detailed process for manufacturing a chip carrier substrate. This innovative process involves several steps, such as providing a first layer of copper conductor on a substrate, forming a first layer of barrier metal, and creating a layer of aluminum. The process further includes patterning the top barrier metal into studs, anodizing the aluminum, and polishing the polymeric dielectric to expose the studs. The resulting chip carrier substrate features a lower layer and at least one upper layer of copper conductors, interconnected by aluminum studs, all surrounded by a polymeric dielectric material.

Career Highlights

Throughout his career, Dror Katz has worked with Amitec-Advanced Multilayer Interconnect Technologies Ltd., where he has applied his expertise in developing advanced interconnect solutions. His work has contributed to the evolution of chip carrier substrates, making them more efficient and reliable for various applications.

Collaborations

Dror Katz has collaborated with notable professionals in his field, including Dror Hurwitz and Boris Yofis. These collaborations have fostered innovation and have played a crucial role in the development of new technologies in the electronics sector.

Conclusion

Dror Katz stands out as a significant figure in the realm of chip carrier substrate technology. His innovative patents and contributions to the industry reflect his dedication to advancing electronic manufacturing processes. His work continues to influence the development of reliable and efficient electronic components.