For the Inventor, By the Inventor

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Pittsburgh, PA, United States of America

Akustica, Inc.

USPTO Granted Patents = 27

EPO Patents = 6

Forward Citations = 196

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31 inventors (with patents filed for the assignee):

Kaigham Jacob Gabriel (7 out of 18 patents)

Andrew Jonathan Doller (6 out of 26 patents)

Daniel Meisel (5 out of 9 patents)

4. Matthew A Zeleznik (5 out of 12 patents)

5. Bernhard Gehl (4 out of 14 patents)

6. Gokhan Hatipoglu (4 out of 6 patents)

7. Xu Zhu (4 out of 5 patents)

8. Yujie Zhang (3 out of 7 patents)

9. Brett Mathew Diamond (3 out of 10 patents)

10. Chinwuba Ezekwe (2 out of 15 patents)

11. Saikrishna Ganta (2 out of 5 patents)

12. Kuldeep Saxena (2 out of 8 patents)

13. Jason P Goodelle (2 out of 3 patents)

14. Jan E Vandemeer (2 out of 2 patents)

15. Christoph Hermes (1 out of 11 patents)

27 patents: Sort by Forward Citations

1. 11012789 - MEMS microphone system (2021-05-18),

2. 10555090 - Microphone with encapsulated moving electrode (2020-02-04),

3. 10555088 - MEMS microphone system having an electrode assembly (2020-02-04),

4. 10448132 - MEMS microphone system with low pressure gap and back volume (2019-10-15),

5. 10442683 - Corrugated package for microelectromechanical system (MEMS) device (2019-10-15),

6. 10349188 - MEMS microphone system and method (2019-07-09),

7. 10295576 - Ratiometric biasing for high impedance capacitive sensing (2019-05-21),

8. 10199344 - Side ported MEMS sensor device package and method of manufacturing thereof (2019-02-05),

9. 10170981 - Configurable bi-directional charge pump design (2019-01-01),

10. 10080082 - Microphone system having high acoustical overload point (2018-09-18),

11. 10070222 - Microphone system having microphone transducer in feedback loop with adjustable frequency -3dB point and improved settling speed (2018-09-04),

12. 10063978 - Cantilevered shear resonance microphone (2018-08-28),

13. 9961452 - MEMS microphone package (2018-05-01),

14. 9781519 - Molded interconnect mircoelectromechanical system (MEMS) device package (2017-10-03),

15. 9686619 - MEMS device with acoustic leak control features (2017-06-20),

Akustica, Inc. is a leading provider of MEMS microphone products that utilize acoustic technology for consumer electronics applications. Their miniature and high-performance microphones offer superior voice and audio quality, enabling clearer communications and enhanced audio experiences. Akustica's MEMS microphones can be found in a wide range of devices including smartphones, laptops, IoT devices, wearables, and more.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 30 2025

27 Patents

#71 in Pittsburgh, PA

#452 in Pennsylvania

#12,009 in US

#23,291 in the World

Pittsburgh, PA, United States of America

Akustica, Inc.

Forward Citations = 196

31 inventors:

Kaigham Jacob Gabriel (7 out of 18 patents)

Andrew Jonathan Doller (6 out of 26 patents)

Daniel Meisel (5 out of 9 patents)

4. Matthew A Zeleznik (5 out of 12 patents)

5. Bernhard Gehl (4 out of 14 patents)

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