For the Inventor, By the Inventor

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Pittsburgh, PA, United States of America

Akustica, Inc.

USPTO Granted Patents = 27

% Expired Patents = 25.9

EPO Patents = 6

Forward Citations = 198

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31 inventors (with patents filed for the assignee):

Kaigham Jacob Gabriel (7 out of 18 patents)

Andrew Jonathan Doller (6 out of 26 patents)

Daniel Meisel (5 out of 9 patents)

4. Matthew A Zeleznik (5 out of 12 patents)

5. Bernhard Gehl (4 out of 15 patents)

6. Gokhan Hatipoglu (4 out of 6 patents)

7. Xu Zhu (4 out of 5 patents)

8. Yujie Zhang (3 out of 7 patents)

9. Brett Mathew Diamond (3 out of 10 patents)

10. Chinwuba Ezekwe (2 out of 15 patents)

11. Saikrishna Ganta (2 out of 5 patents)

12. Kuldeep Saxena (2 out of 9 patents)

13. Jason P Goodelle (2 out of 3 patents)

14. Jan E Vandemeer (2 out of 2 patents)

15. Christoph Hermes (1 out of 11 patents)

Core Competencies:

MEMS Microphone

Acoustic Leak Control

High Impedance Sensing

Microelectromechanical Systems

Charge Pump Design

Wind Immune Microphone

Cantilevered Shear Resonance

Microphone Transducer

Low Pressure Gap

Corrugated Package

Integrated Circuit

High Voltage Biasing

27 patents: Sort by Forward Citations

1. 11012789 - MEMS microphone system (2021-05-18),

2. 10555090 - Microphone with encapsulated moving electrode (2020-02-04),

3. 10555088 - MEMS microphone system having an electrode assembly (2020-02-04),

4. 10448132 - MEMS microphone system with low pressure gap and back volume (2019-10-15),

5. 10442683 - Corrugated package for microelectromechanical system (MEMS) device (2019-10-15),

6. 10349188 - MEMS microphone system and method (2019-07-09),

7. 10295576 - Ratiometric biasing for high impedance capacitive sensing (2019-05-21),

8. 10199344 - Side ported MEMS sensor device package and method of manufacturing thereof (2019-02-05),

9. 10170981 - Configurable bi-directional charge pump design (2019-01-01),

10. 10080082 - Microphone system having high acoustical overload point (2018-09-18),

11. 10070222 - Microphone system having microphone transducer in feedback loop with adjustable frequency -3dB point and improved settling speed (2018-09-04),

12. 10063978 - Cantilevered shear resonance microphone (2018-08-28),

13. 9961452 - MEMS microphone package (2018-05-01),

14. 9781519 - Molded interconnect mircoelectromechanical system (MEMS) device package (2017-10-03),

15. 9686619 - MEMS device with acoustic leak control features (2017-06-20),

Company Overview

Akustica, Inc. is a technology company based in Pittsburgh, PA, specializing in advanced microelectromechanical systems (MEMS) microphones. The company focuses on developing high-performance audio solutions for a variety of applications, including consumer electronics, automotive systems, and industrial devices. With a commitment to innovation, Akustica leverages its expertise in acoustic technology to enhance sound quality and enable new functionalities in devices, positioning itself as a leader in the audio technology sector.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 20 2026

27 Patents

#91 in Pittsburgh, PA

#454 in Pennsylvania

#12,428 in US

#24,034 in the World

Pittsburgh, PA, United States of America

Akustica, Inc.

Forward Citations = 198

31 inventors:

Kaigham Jacob Gabriel (7 out of 18 patents)

Andrew Jonathan Doller (6 out of 26 patents)

Daniel Meisel (5 out of 9 patents)

4. Matthew A Zeleznik (5 out of 12 patents)

5. Bernhard Gehl (4 out of 15 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Akustica, Inc.. Retrieved from https://idiyas.com/company/akustica

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

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