The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 01, 2018

Filed:

Apr. 17, 2015
Applicant:

Robert Bosch Gmbh, Stuttgart, DE;

Inventor:

Jay S. Salmon, Pittsburgh, PA (US);

Assignees:

Akustica, Inc., Pittsburgh, PA (US);

Robert Bosch GmbH, Stuttgart, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04R 25/00 (2006.01); H04R 19/04 (2006.01); B81B 3/00 (2006.01); B81B 7/00 (2006.01); H04R 1/02 (2006.01); H04R 19/00 (2006.01); B81C 1/00 (2006.01); H04R 31/00 (2006.01);
U.S. Cl.
CPC ...
H04R 19/04 (2013.01); B81B 3/00 (2013.01); B81B 7/00 (2013.01); B81B 7/0061 (2013.01); B81C 1/00309 (2013.01); H04R 1/021 (2013.01); H04R 19/005 (2013.01); H04R 31/003 (2013.01); B81B 2201/0257 (2013.01); B81C 2203/019 (2013.01); H04R 2201/003 (2013.01);
Abstract

In one embodiment a micro-electro-mechanical system (MEMS) microphone package includes a multiple layer substrate, an upper acoustic port formed through a plurality of upper layers of the multiple layer substrate and exposing an upper surface of a membrane portion, a lower acoustic port formed through a plurality of lower layers of the multiple layer substrate and exposing a lower surface of the membrane portion, a ring trench formed through at least one of the plurality of upper layers and exposing a metal ring, a MEMS die located above the ring trench, a copper pillar ring extending between the metal ring and the MEMS die, and a solder pillar ring positioned on a first surface of the copper pillar ring, the copper pillar ring and solder pillar ring attaching the MEMS die to the metal ring.


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