The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 15, 2019

Filed:

Feb. 07, 2018
Applicants:

Akustica, Inc., Pittsburgh, PA (US);

Robert Bosch Gmbh, Stuttgart, DE;

Inventors:

Daniel Meisel, Pittsburgh, PA (US);

Andrew Doller, Sharpsburg, PA (US);

Assignees:

Akustica, Inc., Pittsburgh, PA (US);

Robert Bosch GmbH, Stuttgart, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04R 1/04 (2006.01); B81B 7/00 (2006.01); B81B 7/02 (2006.01);
U.S. Cl.
CPC ...
H04R 1/04 (2013.01); B81B 7/0058 (2013.01); B81B 7/0061 (2013.01); B81B 7/02 (2013.01); B81B 2201/0257 (2013.01); B81B 2203/0127 (2013.01); B81B 2203/0163 (2013.01); B81B 2203/04 (2013.01); H04R 2201/003 (2013.01);
Abstract

A MEMS microphone system comprises a transducer die having a pierce-less diaphragm and a motion sensor suspended from the diaphragm. The system further comprises a housing and the diaphragm divided a volume inside the housing into a front volume and a back volume. The motion sensor suspended from the diaphragm is located in the back volume having a gas pressure that is substantially equal or lower than an ambient pressure.


Find Patent Forward Citations

Meisel, Daniel. (2019). Mems microphone system with low pressure gap and back volume (U.S. Patent No. 10448132). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10448132

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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