The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 03, 2017
Filed:
Apr. 14, 2016
Applicants:
Akustica, Inc., Pittsburgh, PA (US);
Robert Bosch Gmbh, Stuttgart, DE;
Inventor:
Kuldeep Saxena, Sewickley, PA (US);
Assignees:
Akustica, Inc., Pittsburgh, PA (US);
Robert Bosch GmbH, Stuttgart, DE;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H04R 19/04 (2006.01); B81B 7/00 (2006.01); H04R 19/00 (2006.01); H04R 1/06 (2006.01); H04R 1/04 (2006.01);
U.S. Cl.
CPC ...
H04R 19/04 (2013.01); B81B 7/0041 (2013.01); H04R 1/04 (2013.01); H04R 1/06 (2013.01); H04R 19/005 (2013.01); B81B 2201/0257 (2013.01); B81B 2207/097 (2013.01); B81C 2203/0118 (2013.01); H04R 2201/003 (2013.01);
Abstract
A microelectromechanical system (MEMS) device package for encapsulating a MEMS device a molded package spacer that connects to a conductive lid and to a substrate. The molded package spacer forms either side walls or a divider of the MEMS device package and is adapted to route electrical connections from the MEMS device to either the substrate or a second MEMS device package via the substrate.