The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 10, 2017
Filed:
Aug. 20, 2015
Invensas Corporation, San Jose, CA (US);
Bongsub Lee, Mountain View, CA (US);
Tu Tam Vu, San Jose, CA (US);
Rajesh Katkar, San Jose, CA (US);
Laura Wills Mirkarimi, Sunol, CA (US);
Akash Agrawal, San Jose, CA (US);
Kyong-Mo Bang, Fremont, CA (US);
Gabriel Z. Guevara, San Jose, CA (US);
Xuan Li, Santa Clara, CA (US);
Long Huynh, Santa Clara, CA (US);
Invensas Corporation, San Jose, CA (US);
Abstract
A fan-out microelectronic package is provided in which bond wires electrically couple bond pads on a microelectronic element, e.g., a semiconductor chip which may have additional traces thereon, with contacts at a fan-out area of a dielectric element adjacent an edge surface of the chip. The bond wires mechanically decouple the microelectronic element from the fan-out area, which can make the electrical interconnections less prone to reliability issues due to effects of differential thermal expansion, such as caused by temperature excursions during initial package fabrication, bonding operations or thermal cycling. In addition, mechanical decoupling provided by the bond wires may also remedy other mechanical issues such as shock and possible delamination of package elements.