Long Huynh

Title: Long Huynh: A Pioneering Inventor Shaping Wafer-Level Packaging

Introduction:

In the vibrant landscape of technological innovation, Long Huynh stands out as an exceptional inventor and contributor to the field of microelectronics. With an impressive portfolio of five patents, Long has showcased his expertise in wafer-level packaging (WLP) techniques. Let's dive deeper into his latest patents and the company he works for.

Latest Patents:

Long Huynh's recent patents demonstrate his strong presence in the field of microelectronic packaging. One of his notable inventions is "Wafer-level packaging using wire bond wires in place of a redistribution layer." This invention involves a microelectronic package design where wire bond wires are employed instead of a traditional redistribution layer. By extending the wire bond wires outside the perimeter of the microelectronic die, Long's design facilitates efficient fan-out capability and efficient use of space.

Another cutting-edge patent by Huynh is titled "Fan-out wafer-level packaging using metal foil lamination." This technology revolutionizes fan-out WLP techniques by incorporating metal foil, such as copper, to relocate bonding pads. By eliminating expensive conventional processes and utilizing metal foils, Long's invention offers cost-effectiveness, improved signal fidelity, reduced interfacial stresses, and enhanced package reliability.

Company: Invensas Corporation

Long Huynh's contributions to the field of microelectronics are further amplified through his affiliation with Invensas Corporation. Invensas Corporation is a renowned technology company that focuses on advanced semiconductor packaging solutions. As an employee of this prestigious organization, Huynh has access to cutting-edge resources and collaborates with talented professionals.

Coworkers:

Long Huynh is privileged to work alongside accomplished individuals in his field. Two notable coworkers are Bongsub Lee and Tu Tam Vu. Together, they form a powerhouse team at Invensas Corporation, driving innovation in microelectronics and pushing the boundaries of what's possible in wafer-level packaging.

Conclusion:

Long Huynh's relentless pursuit of innovation has resulted in five patents that exhibit his remarkable expertise in wafer-level packaging. His inventions showcase an impressive combination of cost-effectiveness, improved signal fidelity, and enhanced package reliability. By contributing to the advancements at Invensas Corporation, Long Huynh plays a critical role in shaping the future of microelectronics and furthering the field of wafer-level packaging.