Xuan Li is a prominent inventor based in Santa Clara, CA (US), known for his contributions to the field of microelectronics. With a total of 6 patents to his name, he has made significant advancements in microelectronic packaging technologies.

Latest Patents

Xuan Li's latest patents include innovative designs that enhance the functionality and efficiency of microelectronic packages. One of his notable inventions is the "Anchoring structure of fine pitch bva," which describes a microelectronic package featuring a substrate with a first and second surface. This design incorporates a first conductive element and multiple wire bonds, each connected to the conductive elements. The encapsulation in this package includes a recess that accommodates the tips of the wire bonds, ensuring effective electrical connections.

Another significant patent is "Wafer-level packaging using wire bond wires in place of a redistribution layer." This invention outlines an apparatus where a microelectronic die is equipped with wire bond wires that extend into a fan-out region. The design is covered with a molding material, enhancing the structural integrity and performance of the microelectronic package.

Career Highlights

Xuan Li is currently employed at Adeia Semiconductor Bonding Technologies Inc., where he continues to innovate in the field of microelectronics. His work has been instrumental in developing advanced packaging solutions that meet the growing demands of the technology industry.

Collaborations

Throughout his career, Xuan Li has collaborated with talented professionals, including Rajesh Katkar and Gabriel Z Guevara. These collaborations have fostered a creative environment that encourages the development of cutting-edge technologies.

Conclusion

Xuan Li's contributions to microelectronic packaging have established him as a key figure in the industry. His innovative patents and collaborative efforts continue to drive advancements in technology, making a lasting impact on the field.

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