Kyong-Mo Bang

Title: Kyong-Mo Bang: Innovative Microelectronic Package Designer

Introduction:

In the vast field of microelectronics, where miniaturization and efficient circuit design are key, Kyong-Mo Bang has emerged as a prominent inventor and patent holder. With 19 patents to his name, he has made significant contributions to the field of microelectronic packages, particularly focusing on stacked die and wire bond interconnects. Currently working at Invensas Corporation in Fremont, CA, Bang collaborates with talented colleagues such as Belgacem Haba and Zhuowen Sun.

Microelectronic Packages with Stacked Die and Wire Bond Interconnects:

One of Kyong-Mo Bang's noteworthy inventions entails the development of microelectronic packages that incorporate stacked die and wire bond interconnects. This technology involves multiple microelectronic elements arranged parallel to each other and encapsulated with an encapsulation region. Wire bonds are used to connect the microelectronic elements with first package contacts, which are integrated onto the encapsulation region. The second package contacts, located at an interconnect surface, can include portions of the wire bonds and electrically conductive structures. This invention enables the efficient stacking and interconnection of microelectronic elements, enhancing performance and reliability.

Stackable Microelectronic Package Structures:

Another notable patent belonging to Kyong-Mo Bang involves the design of stackable microelectronic package structures. This innovation allows for the integration of multiple microelectronic packages to create a more compact and versatile assembly. The first microelectronic package comprises a substrate with microelectronic elements arranged on opposing surfaces. The interconnect area on the first surface provides space for interconnecting these elements and creating stack terminals. By joining the stack terminals of the first microelectronic package with terminals of a second microelectronic package overlaid on top, a complex multi-layered microelectronic assembly can be achieved. This technology proves invaluable for applications where space optimization and integration are important considerations.

Collaboration at Invensas Corporation:

Kyong-Mo Bang works at Invensas Corporation, a renowned company specializing in advanced semiconductor and microelectronics technologies. The company is known for its innovative solutions that enable the development of high-performance and compact electronic devices. Collaborating with accomplished colleagues like Belgacem Haba and Zhuowen Sun, Bang is part of a dynamic team focused on pushing the boundaries of microelectronics design, packaging, and integration.

Conclusion:

Kyong-Mo Bang's extensive patent portfolio and groundbreaking inventions in the area of microelectronic packages with stacked die and wire bond interconnects have positioned him as a recognized innovator in the field. His contributions to the industry continue to shape the development of high-performance and miniaturized electronic devices. Working alongside talented colleagues at Invensas Corporation, Bang exemplifies the spirit of innovation and dedication to advancing microelectronics technology.