San Jose, CA, United States of America

Tu Tam Vu


Average Co-Inventor Count = 6.8

ph-index = 2

Forward Citations = 12(Granted Patents)


Company Filing History:


Years Active: 2016-2018

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7 patents (USPTO):

Title: The Innovative Contributions of Tu Tam Vu

Introduction

Tu Tam Vu is a prominent inventor based in San Jose, CA, known for his significant contributions to the field of microelectronics. With a total of 7 patents to his name, Vu has made remarkable advancements in packaging technologies that enhance the performance and efficiency of microelectronic devices.

Latest Patents

Among his latest patents is a groundbreaking invention titled "Wafer-level packaging using wire bond wires in place of a redistribution layer." This patent describes an apparatus that involves a microelectronic package where a microelectronic die features a first surface, a second surface, and a sidewall surface. The invention utilizes a plurality of wire bond wires that are coupled to the die, extending into a fan-out region, thereby improving the packaging process. Another notable patent is "Flipped die stacks with multiple rows of leadframe interconnects." This innovation focuses on stacked microelectronic packages that allow for increased packing density by enabling nonparallel orientations of major surfaces with respect to the substrate.

Career Highlights

Tu Tam Vu is currently associated with Adeia Semiconductor Bonding Technologies Inc., where he continues to push the boundaries of microelectronic packaging. His work has been instrumental in developing technologies that are crucial for the advancement of semiconductor devices.

Collaborations

Throughout his career, Vu has collaborated with talented professionals in the field, including Rajesh Katkar and Xuan Li. These collaborations have fostered an environment of innovation and creativity, leading to the development of cutting-edge technologies.

Conclusion

Tu Tam Vu's contributions to microelectronics through his patents and collaborations highlight his role as a leading inventor in the industry. His work continues to influence the future of semiconductor technology and packaging solutions.

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