The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 03, 2010
Filed:
Dec. 02, 2005
Shinji Himori, Nirasaki, JP;
Noriaki Imai, Nirasaki, JP;
Katsumi Horiguchi, Amagasaki, JP;
Takaaki Nezu, Nirasaki, JP;
Shoichiro Matsuyama, Nirasaki, JP;
Hiroki Matsumaru, Nirasaki, JP;
Toshihiro Hayami, Nirasaki, JP;
Kazuya Nagaseki, Nirasaki, JP;
Itsuko Sakai, Yokohama, JP;
Tokuhisa Ohiwa, Kawasaki, JP;
Yoshikazu Sugiyasu, Nirasaki, JP;
Shinji Himori, Nirasaki, JP;
Noriaki Imai, Nirasaki, JP;
Katsumi Horiguchi, Amagasaki, JP;
Takaaki Nezu, Nirasaki, JP;
Shoichiro Matsuyama, Nirasaki, JP;
Hiroki Matsumaru, Nirasaki, JP;
Toshihiro Hayami, Nirasaki, JP;
Kazuya Nagaseki, Nirasaki, JP;
Itsuko Sakai, Yokohama, JP;
Tokuhisa Ohiwa, Kawasaki, JP;
Yoshikazu Sugiyasu, Nirasaki, JP;
Tokyo Electron Limited, Tokyo, JP;
Kabushiki Kaisha Toshiba, Tokyo, JP;
Abstract
A capacitive coupling plasma processing apparatus includes a process chamber configured to have a vacuum atmosphere, and a process gas supply section configured to supply a process gas into the chamber. In the chamber, a first electrode and a second electrode are disposed opposite each other. An RF power supply is disposed to supply an RF power to the first or second electrode to form an RF electric field within a plasma generation region between the first and second electrodes, so as to turn the process gas into plasma. The target substrate is supported by a support member between the first and second electrodes such that a process target surface thereof faces the second electrode. A conductive functional surface is disposed in a surrounding region around the plasma generation region and grounded to be coupled with the plasma in a sense of DC to expand the plasma.