The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 02, 2022
Filed:
Aug. 13, 2018
Versum Materials Us, Llc, Tempe, AZ (US);
Xiaobo Shi, Tempe, AZ (US);
Laura M. Matz, Tempe, AZ (US);
Chris Keh-Yeuan Li, Tempe, AZ (US);
Ming-Shih Tsai, Tempe, AZ (US);
Pao-Chia Pan, Tempe, AZ (US);
Chad Chang-Tse Hsieh, Tempe, AZ (US);
Rung-Je Yang, Tempe, AZ (US);
Blake J. Lew, Tempe, AZ (US);
Mark Leonard O'Neill, Tempe, AZ (US);
Agnes Derecskei, Tempe, AZ (US);
VERSUM MATERIALS US, LLC, Tempe, AZ (US);
Abstract
Provided are Chemical Mechanical Planarization (CMP) formulations that offer high and tunable Cu removal rates and low copper dishing for the broad or advanced node copper or Through Silica Via (TSV). The CMP compositions provide high selectivity of Cu film vs. other barrier layers, such as Ta, TaN, Ti, and TiN, and dielectric films, such as TEOS, low-k, and ultra low-k films. The CMP polishing formulations comprise solvent, abrasive, at least three chelators selected from the group consisting of amino acids, amino acid derivatives, organic amine, and combinations therefor; wherein at least one chelator is an amino acid or an amino acid derivative. Additionally, organic quaternary ammonium salt, corrosion inhibitor, oxidizer, pH adjustor and biocide are used in the formulations.