Tempe, AZ, United States of America

Blake J Lew

USPTO Granted Patents = 2 

 

Average Co-Inventor Count = 4.6

ph-index = 1


Location History:

  • Scottsdale, AZ (US) (2020)
  • Tempe, AZ (US) (2022)

Company Filing History:


Years Active: 2020-2022

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2 patents (USPTO):

Title: Innovations by Blake J Lew in Chemical Mechanical Planarization

Introduction

Blake J Lew is a notable inventor based in Tempe, AZ (US), recognized for his contributions to the field of chemical mechanical planarization (CMP). With a total of 2 patents, Lew has made significant advancements in CMP formulations that enhance the efficiency and effectiveness of semiconductor manufacturing processes.

Latest Patents

Lew's latest patents include innovative CMP compositions designed for copper and through-silica via (TSV) applications. These formulations provide high and tunable copper removal rates while minimizing copper dishing, making them suitable for both broad and advanced node copper applications. The CMP compositions exhibit high selectivity of copper film against various barrier layers, including tantalum (Ta), tantalum nitride (TaN), titanium (Ti), and titanium nitride (TiN), as well as dielectric films such as TEOS, low-k, and ultra low-k films. Additionally, his invention related to dishing reduction in tungsten CMP focuses on slurries, methods, and systems that effectively reduce dishing on both large and small feature sizes without hindering the tungsten removal rate.

Career Highlights

Blake J Lew is currently employed at Versum Materials US, LLC, where he continues to innovate in the field of semiconductor materials. His work has been instrumental in developing CMP formulations that address the challenges faced in modern semiconductor manufacturing.

Collaborations

Throughout his career, Lew has collaborated with talented individuals such as Xiaobo Shi and Laura M Matz, contributing to the advancement of CMP technologies.

Conclusion

Blake J Lew's contributions to chemical mechanical planarization have significantly impacted the semiconductor industry. His innovative patents and formulations continue to enhance manufacturing processes, demonstrating his commitment to advancing technology in this critical field.

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