Chad Chang-Tse Hsieh

Title: The Innovations of Chad Chang-Tse Hsieh

Introduction

Chad Chang-Tse Hsieh is a notable inventor based in Tempe, AZ (US). He has made significant contributions to the field of chemical mechanical planarization (CMP) technology. His work focuses on enhancing the efficiency and effectiveness of CMP formulations, particularly for copper and through-silica via (TSV) applications.

Latest Patents

Hsieh holds a patent for a CMP composition and methods that provide high and tunable copper removal rates while minimizing copper dishing. This innovation is crucial for both broad and advanced node copper applications. The CMP compositions he developed demonstrate high selectivity of copper film against various barrier layers, including tantalum (Ta), tantalum nitride (TaN), titanium (Ti), and titanium nitride (TiN). Additionally, they are effective against dielectric films such as TEOS, low-k, and ultra low-k films. The formulations consist of solvents, abrasives, and at least three chelators, which include amino acids and their derivatives. Other components include organic quaternary ammonium salts, corrosion inhibitors, oxidizers, pH adjustors, and biocides.

Career Highlights

Chad Hsieh is currently employed at Versum Materials US, LLC, where he continues to innovate in the field of CMP technology. His work has been instrumental in advancing the capabilities of CMP formulations, making them more efficient and effective for various applications.

Collaborations

Hsieh has collaborated with notable colleagues, including Xiaobo Shi and Laura M Matz, to further enhance the development of CMP technologies. Their combined expertise has contributed to the success of their projects and innovations.

Conclusion

Chad Chang-Tse Hsieh is a prominent inventor whose work in chemical mechanical planarization has significantly impacted the industry. His innovative CMP compositions and methods continue to push the boundaries of technology, making him a key figure in this field.