Rung-Je Yang

Title: Rung-Je Yang: Innovator in Chemical Mechanical Planarization

Introduction

Rung-Je Yang is a notable inventor based in Tempe, AZ (US), recognized for his contributions to the field of chemical mechanical planarization (CMP). With a total of 2 patents, Yang has made significant advancements in polishing compositions that are essential for semiconductor device manufacturing.

Latest Patents

Yang's latest patents include a chemical mechanical planarization composition for polishing oxide materials and a CMP composition for copper and through-silica via (TSV) applications. The first patent focuses on polishing compositions that utilize ceria-coated silica particles and organic acids, achieving high silicon oxide removal rates. The second patent presents CMP formulations that provide high and tunable copper removal rates while minimizing copper dishing, ensuring high selectivity of copper films against various barrier layers and dielectric films.

Career Highlights

Rung-Je Yang is currently employed at Versum Materials US, LLC, where he continues to innovate in the CMP field. His work has been pivotal in enhancing the efficiency and effectiveness of semiconductor manufacturing processes.

Collaborations

Yang collaborates with esteemed colleagues, including Ming-Shih Tsai and Chris Keh-Yeuan Li, contributing to a dynamic research environment that fosters innovation.

Conclusion

Rung-Je Yang's contributions to chemical mechanical planarization highlight his role as a key inventor in the semiconductor industry. His innovative patents and collaborative efforts continue to shape advancements in this critical field.