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For the Inventor, By the Inventor

Dali, Taiwan

Yung Ching Chen

USPTO Granted Patents = 12 

Average Co-Inventor Count = 4.8

ph-index = 3

Forward Citations = 95(Granted Patents)


Company Filing History:

goldMedal12 out of 40,674 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2014-2022

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12 patents (USPTO):Explore Patents
1. RE49045 - Package on package devices and methods of packaging semiconductor dies (2022-04-18),
2. 11139281 - Molded underfilling for package on package devices (2021-10-05),
3. 10090345 - Interconnect structure for CIS flip-chip bonding and methods for forming the same (2018-10-02),
4. 10020286 - Package on package devices and methods of packaging semiconductor dies (2018-07-10),
5. 9768105 - Rigid interconnect structures in package-on-package assemblies (2017-09-19),
6. 9397137 - Interconnect structure for CIS flip-chip bonding and methods for forming the same (2016-07-19),
7. 9362197 - Molded underfilling for package on package devices (2016-06-07),
8. 9171790 - Package on package devices and methods of packaging semiconductor dies (2015-10-27),
9. 8927877 - Looped interconnect structure (2015-01-06),
10. 8890274 - Interconnect structure for CIS flip-chip bonding and methods for forming the same (2014-11-18),
11. 8796132 - System and method for forming uniform rigid interconnect structures (2014-08-05),
12. 8642393 - Package on package devices and methods of forming same (2014-02-04),

Title: Innovations by Yung Ching Chen: A Pioneer in Semiconductor Packaging

Introduction

Yung Ching Chen is a notable inventor based in Dali, Taiwan, with an impressive portfolio of 12 patents. His contributions primarily lie in the field of semiconductor packaging, where his innovations have significantly advanced industry standards and practices.

Latest Patents

Among his latest patents, two stand out for their ingenuity and technical depth:

1. **Package on Package Devices** - This patent details methods for packaging semiconductor dies in a configuration where a first packaged die and a second packaged die are coupled together using metal stud bumps. These bumps play a critical role in creating reliable electrical connections between the two dies.

2. **Molded Underfilling for Package on Package Devices** - This innovation involves a package-on-package device that includes a specially designed molded underfill. The method presented offers insights into applying underfill material that ensures structural integrity while optimizing performance.

Career Highlights

Yung Ching Chen is a key player at Taiwan Semiconductor Manufacturing Company Limited, where he has leveraged his expertise to contribute to pioneering semiconductor technologies. His work not only enhances the performance of semiconductor devices but also influences manufacturing processes across the industry.

Collaborations

Throughout his career, Chen has collaborated with esteemed colleagues, including Chen-Hua Douglas Yu and Chien-Hsun Lee. Together, they have combined their knowledge and skills to push the boundaries of what is possible in semiconductor packaging, fostering innovation and creativity.

Conclusion

Yung Ching Chen exemplifies the spirit of innovation in the semiconductor field. His patents reflect a deep understanding of technology and a commitment to improvement. With active involvement at Taiwan Semiconductor Manufacturing Company Limited and collaborations with talented colleagues, Chen's contributions are likely to continue shaping the future of semiconductor packaging.

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