The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 07, 2016
Filed:
Nov. 02, 2012
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Chen-Hua Yu, Hsin-Chu, TW;
Chien-Hsun Lee, Chu-tung Town, TW;
Jung Wei Cheng, Hsin-Chu, TW;
Tsung-Ding Wang, Tainan, TW;
Ming-Da Cheng, Jhubei, TW;
Yung Ching Chen, Dali, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Abstract
Presented herein are a package-on-package device having a molded underfill and a method for forming the same, the method comprising applying a package mount mounting a die to the first side of a carrier package. A molded underfill may be applied first side of the carrier package, and be in contact with a portion of the package mount a portion of a sidewall of the die. A top package having at least one land may be mounted to the first side of the carrier package above the die, and, optionally separated from the top of the die. The package mount may be coined prior to, during or after applying the molded underfill to optionally be level with the underfill surface. The underfill region contacting the package mount may be below or above the surface of the underfill region contacting the die sidewall.