Average Co-Inventor Count = 4.77
ph-index = 3
The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.
Company Filing History:
1. Taiwan Semiconductor Manufacturing Comp. Ltd. (12 from 40,674 patents)
12 patents:
1. RE49045 - Package on package devices and methods of packaging semiconductor dies
2. 11139281 - Molded underfilling for package on package devices
3. 10090345 - Interconnect structure for CIS flip-chip bonding and methods for forming the same
4. 10020286 - Package on package devices and methods of packaging semiconductor dies
5. 9768105 - Rigid interconnect structures in package-on-package assemblies
6. 9397137 - Interconnect structure for CIS flip-chip bonding and methods for forming the same
7. 9362197 - Molded underfilling for package on package devices
8. 9171790 - Package on package devices and methods of packaging semiconductor dies
9. 8927877 - Looped interconnect structure
10. 8890274 - Interconnect structure for CIS flip-chip bonding and methods for forming the same
11. 8796132 - System and method for forming uniform rigid interconnect structures
12. 8642393 - Package on package devices and methods of forming same