The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 18, 2022
Filed:
Aug. 06, 2017
Applicant:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Inventors:
Assignee:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/52 (2005.12); H01L 23/14 (2005.12); H01L 25/10 (2005.12); H01L 25/00 (2005.12); H01L 23/498 (2005.12); H01L 23/00 (2005.12); H01L 25/065 (2005.12); H01L 23/525 (2005.12);
U.S. Cl.
CPC ...
H01L 23/147 (2012.12); H01L 23/49811 (2012.12); H01L 23/49822 (2012.12); H01L 23/49827 (2012.12); H01L 24/97 (2012.12); H01L 25/105 (2012.12); H01L 25/50 (2012.12); H01L 23/525 (2012.12); H01L 24/06 (2012.12); H01L 24/13 (2012.12); H01L 24/16 (2012.12); H01L 24/32 (2012.12); H01L 24/45 (2012.12); H01L 24/48 (2012.12); H01L 24/73 (2012.12); H01L 24/78 (2012.12); H01L 24/81 (2012.12); H01L 24/92 (2012.12); H01L 25/0657 (2012.12); H01L 2224/0401 (2012.12); H01L 2224/04042 (2012.12); H01L 2224/06155 (2012.12); H01L 2224/131 (2012.12); H01L 2224/16225 (2012.12); H01L 2224/32145 (2012.12); H01L 2224/32225 (2012.12); H01L 2224/451 (2012.12); H01L 2224/45124 (2012.12); H01L 2224/45144 (2012.12); H01L 2224/45147 (2012.12); H01L 2224/45164 (2012.12); H01L 2224/45169 (2012.12); H01L 2224/48227 (2012.12); H01L 2224/73204 (2012.12); H01L 2224/73265 (2012.12); H01L 2224/78301 (2012.12); H01L 2224/81815 (2012.12); H01L 2224/92125 (2012.12); H01L 2224/97 (2012.12); H01L 2225/0651 (2012.12); H01L 2225/06517 (2012.12); H01L 2225/06558 (2012.12); H01L 2225/06565 (2012.12); H01L 2225/1023 (2012.12); H01L 2225/1058 (2012.12); H01L 2924/00014 (2012.12); H01L 2924/01029 (2012.12); H01L 2924/10253 (2012.12); H01L 2924/14 (2012.12); H01L 2924/1431 (2012.12); H01L 2924/1434 (2012.12); H01L 2924/157 (2012.12); H01L 2924/15311 (2012.12); H01L 2924/15331 (2012.12); H01L 2924/15786 (2012.12); H01L 2924/15788 (2012.12); H01L 2924/181 (2012.12);
Abstract
Package on package (PoP) devices and methods of packaging semiconductor dies are disclosed. A PoP device includes a first packaged die and a second packaged die coupled to the first packaged die. Metal stud bumps are disposed between the first packaged die and the second packaged die. The metal stud bumps include a bump region and a tail region coupled to the bump region. The metal stud bumps are embedded in solder joints.