The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 04, 2014
Filed:
Aug. 08, 2012
Chen-hua Yu, Hsin-Chu, TW;
Mirng-ji Lii, Sinpu Township, TW;
Chien-hsun Lee, Chu-Tung Town, TW;
Yung Ching Chen, Dali, TW;
Jiun Yi Wu, Zhongli, TW;
Chen-Hua Yu, Hsin-Chu, TW;
Mirng-Ji Lii, Sinpu Township, TW;
Chien-Hsun Lee, Chu-Tung Town, TW;
Yung Ching Chen, Dali, TW;
Jiun Yi Wu, Zhongli, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Abstract
An embodiment is a package-on-package (PoP) device comprising a first package on a first substrate and a second package over the first package. A plurality of wire sticks disposed between the first package and the second package and the plurality of wire sticks couple the first package to the second package. Each of the plurality of wire sticks comprise a conductive wire of a first height affixed to a bond pad on the first substrate and each of the plurality of wire sticks is embedded in a solder joint.