The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 27, 2015
Filed:
Jul. 18, 2012
Chen-hua Yu, Hsin-Chu, TW;
Yung Ching Chen, Dali, TW;
Chien-hsun Lee, Chu-tung, TW;
Jiun Yi Wu, Zhongli, TW;
Mirng-ji Lii, Sinpu Township, TW;
Ming-da Cheng, Jhubei, TW;
Chen-Hua Yu, Hsin-Chu, TW;
Yung Ching Chen, Dali, TW;
Chien-Hsun Lee, Chu-tung, TW;
Jiun Yi Wu, Zhongli, TW;
Mirng-Ji Lii, Sinpu Township, TW;
Ming-Da Cheng, Jhubei, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Abstract
Package on package (PoP) devices and methods of packaging semiconductor dies are disclosed. A PoP device includes a first packaged die and a second packaged die coupled to the first packaged die. Metal stud bumps are disposed between the first packaged die and the second packaged die. The metal stud bumps include a stick region, a first ball region coupled to a first end of the stick region, and a second ball region coupled to a second end of the stick region. The metal stud bumps include a portion that is partially embedded in a solder joint.