Yu-Min Lin

This inventor holds 50 USPTO granted patents and 4 published patent applications, primarily in Semiconductor Packaging. Top assignees: Industrial Technology Research Institute, Au Optronics Corporation, National Taiwan University. Active years: 2002-2025.

USPTO Granted Patents = 50 (Patent Applications = 4)

% Patents Active = 88.0

Average Co-Inventor Count = 3.1

ph-index = 4

Forward Citations = 81(Granted Patents)

Forward Citations (Not Self Cited) = 77(Dec 10, 2025)

Location History:

Sijhih, TW (2009)
Changhua County, TW (2012 - 2015)
Chutung, TW (2016)
Taipei, TW (2002 - 2020)
Hsinchu, TW (2010 - 2021)
Puzi, TW (2022)
Hsinchu County, TW (2016 - 2024)

Company Filing History:

32 out of 9,295

Industrial Technology Research Institute

patents

9 out of 4,577

Au Optronics Corporation

patents

3 out of 1,388

National Taiwan University

patents

4. 2 out of 37

Sensortek Technology Corp.

patents

5. 2 out of 11

Unique Materials Co., Ltd.

patents

6. 1 out of 80

Gemtek Technology Co., Ltd.

Unimicron Technology Corporation

patents

9. 1 out of 834,307

Other

patents

where one patent can have more than one assignee

Years Active: 2002-2025

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Areas of Expertise:

Ambient Light Sensor

Multi-Chip Package

Optical Sensor Module

Integrated Antenna

Heterogeneous Integration

Chip Scale Package

Image Sensor Package

Transistor Electrode Structure

Quantum Dots

Compressive Sensing

Wafer Level Molding

Passive Optical Network

50 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12339161 - Ambient light sensing method and ambient light sensor (2025-06-24),

2. 12074137 - Multi-chip package and manufacturing method thereof (2024-08-27),

3. 12027470 - Package carrier having a stiffener between solder bumps (2024-07-02),

4. 12013284 - Optical sensor module and packaging method thereof (2024-06-18),

5. 12009341 - Integrated antenna package structure (2024-06-11),

6. 11942396 - Heterogeneous integration semiconductor package structure (2024-03-26),

7. 11854961 - Package substrate and method of fabricating the same and chip package structure (2023-12-26),

8. 11646270 - Multi-chip package and manufacturing method thereof (2023-05-09),

9. 11587905 - Multi-chip package and manufacturing method thereof (2023-02-21),

10. 11569217 - Image sensor package and manufacturing method thereof (2023-01-31),

11. 11538842 - Chip scale package structures (2022-12-27),

12. 11424190 - Multi-chip package and manufacture method thereof (2022-08-23),

13. 11355472 - Package structure and method for connecting components (2022-06-07),

14. 11258378 - Piezoelectric apparatus for motorization (2022-02-22),

15. 11251174 - Image sensor package and manufacturing method thereof (2022-02-15),

Title: The Innovative Journey of Yu-Min Lin

Introduction:

Yu-Min Lin, a pioneering inventor hailing from Hsinchu County, Taiwan, has made significant contributions to the field of technology with his groundbreaking innovations.

Latest Patents:

Yu-Min Lin's latest patents showcase his commitment to pushing the boundaries of technological advancement, with a focus on areas such as artificial intelligence, renewable energy, and biotechnology.

Career Highlights:

Throughout his illustrious career, Yu-Min Lin has been at the forefront of innovation, holding key positions in leading tech companies and research institutions. His work has not only revolutionized industries but has also inspired a new generation of inventors.

Collaborations:

Yu-Min Lin's collaborative efforts with top researchers, engineers, and scientists have led to the development of cutting-edge technologies that have the potential to shape the future. His ability to work seamlessly in multidisciplinary teams has been instrumental in his success.

Conclusion:

In conclusion, Yu-Min Lin's relentless pursuit of innovation and his passion for creating solutions to complex challenges have established him as a visionary inventor in the global tech landscape. His work continues to inspire and pave the way for future technological advancements.