IDiyas

For the Inventor, By the Inventor

Hsinchu County, Taiwan

Yu-Min Lin

USPTO Granted Patents = 50 

Average Co-Inventor Count = 3.1

ph-index = 4

Forward Citations = 77(Granted Patents)

DiyaCoin DiyaCoin = 0.20 


Location History:

  • Sijhih, TW (2009)
  • Changhua County, TW (2012 - 2015)
  • Chutung, TW (2016)
  • Taipei, TW (2002 - 2020)
  • Hsinchu, TW (2010 - 2021)
  • Puzi, TW (2022)
  • Hsinchu County, TW (2016 - 2024)

Company Filing History:

goldMedal32 out of 9,138 
 
Industrial Technology Research Institute
 patents
silverMedal9 out of 4,573 
 
Au Optronics Corporation
 patents
bronzeMedal3 out of 1,712 
 
National Taiwan University
 patents
4. 2 out of 11 
 
Unique Materials Co., Ltd.
 patents
5. 2 out of 34 
 
Sensortek Technology Corp.
 patents
6. 1 out of 497 
 
Unimicron Technology Corporation
 patents
7. 1 out of 79 
 
Gemtek Technology Co., Ltd.
 patents
8. 1 out of 4,763 
 
Mediatek Corporation
 patents
9. 1 out of 832,680 
Other
 patents
where one patent can have more than one assignee

Years Active: 2002-2025

where 'Filed Patents' based on already Granted Patents

50 patents (USPTO):
1. 12339161 - Ambient light sensing method and ambient light sensor (2025-06-24),
2. 12074137 - Multi-chip package and manufacturing method thereof (2024-08-27),
3. 12027470 - Package carrier having a stiffener between solder bumps (2024-07-02),
4. 12013284 - Optical sensor module and packaging method thereof (2024-06-18),
5. 12009341 - Integrated antenna package structure (2024-06-11),
6. 11942396 - Heterogeneous integration semiconductor package structure (2024-03-26),
7. 11854961 - Package substrate and method of fabricating the same and chip package structure (2023-12-26),
8. 11646270 - Multi-chip package and manufacturing method thereof (2023-05-09),
9. 11587905 - Multi-chip package and manufacturing method thereof (2023-02-21),
10. 11569217 - Image sensor package and manufacturing method thereof (2023-01-31),
11. 11538842 - Chip scale package structures (2022-12-27),
12. 11424190 - Multi-chip package and manufacture method thereof (2022-08-23),
13. 11355472 - Package structure and method for connecting components (2022-06-07),
14. 11258378 - Piezoelectric apparatus for motorization (2022-02-22),
15. 11251174 - Image sensor package and manufacturing method thereof (2022-02-15),

Title: The Innovative Journey of Yu-Min Lin

Introduction:

Yu-Min Lin, a pioneering inventor hailing from Hsinchu County, Taiwan, has made significant contributions to the field of technology with his groundbreaking innovations.

Latest Patents:

Yu-Min Lin's latest patents showcase his commitment to pushing the boundaries of technological advancement, with a focus on areas such as artificial intelligence, renewable energy, and biotechnology.

Career Highlights:

Throughout his illustrious career, Yu-Min Lin has been at the forefront of innovation, holding key positions in leading tech companies and research institutions. His work has not only revolutionized industries but has also inspired a new generation of inventors.

Collaborations:

Yu-Min Lin's collaborative efforts with top researchers, engineers, and scientists have led to the development of cutting-edge technologies that have the potential to shape the future. His ability to work seamlessly in multidisciplinary teams has been instrumental in his success.

Conclusion:

In conclusion, Yu-Min Lin's relentless pursuit of innovation and his passion for creating solutions to complex challenges have established him as a visionary inventor in the global tech landscape. His work continues to inspire and pave the way for future technological advancements.

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