The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 23, 2022
Filed:
Aug. 27, 2020
Industrial Technology Research Institute, Hsinchu, TW;
Chao-Jung Chen, Hsinchu County, TW;
Yu-Min Lin, Hsinchu County, TW;
Sheng-Tsai Wu, Taoyuan, TW;
Shin-Yi Huang, Hsinchu County, TW;
Ang-Ying Lin, Tainan, TW;
Tzu-Hsuan Ni, Hsinchu, TW;
Yuan-Yin Lo, Hsinchu, TW;
Industrial Technology Research Institute, Hsinchu, TW;
Abstract
A multi-chip package and a manufacturing method thereof are provided. The multi-chip package includes: an interposer including a dielectric body, a plurality of semiconductor bodies separated by the dielectric body, a through via penetrating through the dielectric body, and a wiring structure located in each of the plurality of semiconductor bodies; a plurality of semiconductor chips located side by side on a first surface of the interposer and electrically connected to the wiring structure; an encapsulant located on the first surface of the interposer and encapsulating at least a portion of the plurality of semiconductor chips; and a redistribution circuit structure located on a second surface of the interposer opposite to the first surface of the interposer and electrically connected to the plurality of semiconductor chips through the through via.