The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 09, 2023
Filed:
Oct. 08, 2020
Industrial Technology Research Institute, Hsinchu, TW;
Ang-Ying Lin, Tainan, TW;
Yu-Min Lin, Hsinchu County, TW;
Shin-Yi Huang, Hsinchu County, TW;
Sheng-Tsai Wu, Taoyuan, TW;
Yuan-Yin Lo, Kaohsiung, TW;
Tzu-Hsuan Ni, Hsinchu, TW;
Chao-Jung Chen, Hsinchu County, TW;
Industrial Technology Research Institute, Hsinchu, TW;
Abstract
A multi-chip package and a manufacturing method thereof are provided. The multi-chip package includes: an interposer including a wiring structure and an interposer via electrically connected to the wiring structure; a plurality of semiconductor chips located on a first surface of the interposer and electrically connected to each other through the interposer; an encapsulant located on the first surface of the interposer and encapsulating at least a portion of the plurality of semiconductor chips; and a redistribution circuit structure located on a second surface of the interposer opposite to the first surface, wherein the plurality of semiconductor chips are electrically connected to the redistribution circuit structure through at least the interposer.